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February 1997

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Subject:
RE: FAB:Laser vias
From:
"Thomas, Kevin" <[log in to unmask]>
Date:
Mon, 17 Feb 1997 08:31:00 -0700
Content-Type:
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David -
AlliedSignal provides Resin Coated Copper with several varying resin
thicknesses with the thinnest being 2 mils.  Ranges are 2 mils up to 4
mils.  It is available on 18 or 12 micron ml or mls copper foil.

Kevin R. Thomas
MicroVia Materials Product Manager
AlliedSignal Laminate Systems
608.791.2288

 ----------
>>>From: David Arivett
>>>To: [log in to unmask]
>>>Subject: FAB:Laser vias
>>>Date: Saturday, February 15, 1997 12:54PM
>>>
>>>
>>>
>>>
>>>  An article in the February edition of PCFAB talks about laser drilled
>>>micro-vias. It shows a multi-layer stack-up of two cores with pre preg in
>>>the center. The outer layers are formed with resin coated foil. My question
>>>is: how thick is the resin on the foil? I am sure it must be at least 2
>>>mils
>>>in order to have enough resin to encapsulate the inner layer circuitry.
>>>What
>>>is the maximum it might be?
>>>
>>>David Arivett
>>>Cuplex Inc.
>>>
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