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February 1997

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Subject:
RE: FAB:Laser vias
From:
"Kuwako, Fujio(MMS)" <[log in to unmask]>
Date:
Mon, 17 Feb 1997 10:36:32 +0900
Content-Type:
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David-san:

There are several resin coated foil suppliers in the world. 
Basically two different types of products are available. 
B-stage only resin coated and B-stage/C-stage resin coated. 
We know the example of B-stage only resin coated foil. 

  Resin thickness:  80 microns
  Innerlayer copper thickness: 35 to 45 microns
  Insulation thickness after lamination: 50 to 60 microns

The maximum resin thickness is 100 microns. 

F.Kuwako
Mitsui Mining & Smelting Co.
----------
> 差出人 : David Arivett <[log in to unmask]>
> 宛先 : [log in to unmask]
> ﾀｲﾄﾙ : FAB:Laser vias
> 送信日時 : 1997年2月16日 4:54
> 
> 
> 
>   An article in the February edition of PCFAB talks about laser drilled
> micro-vias. It shows a multi-layer stack-up of two cores with pre preg in
> the center. The outer layers are formed with resin coated foil. My
question
> is: how thick is the resin on the foil? I am sure it must be at least 2
mils
> in order to have enough resin to encapsulate the inner layer circuitry.
What
> is the maximum it might be?
> 
> David Arivett
> Cuplex Inc.
> 
>
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