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February 1997

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Subject:
FAB:Laser vias
From:
David Arivett <[log in to unmask]>
Date:
Sat, 15 Feb 1997 13:54:12 -0600 (CST)
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  An article in the February edition of PCFAB talks about laser drilled
micro-vias. It shows a multi-layer stack-up of two cores with pre preg in
the center. The outer layers are formed with resin coated foil. My question
is: how thick is the resin on the foil? I am sure it must be at least 2 mils
in order to have enough resin to encapsulate the inner layer circuitry. What
is the maximum it might be?

David Arivett
Cuplex Inc.

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