Screen printing with epoxy ink to fill via holes have led to small
bubbles entrapment inside the holes.  Due to high viscosity of the
ink, the bubbles are unable to free themselves evenafter very long
hold time.
Kindly clarify, whether there will be any reliability problems and
how to go about it.  If not, please specify in-house testing of
via holes for BGA and also the IPC specifications for the same.

From: murali rama rao
      Process Department
      E-mail:[log in to unmask]
Hitachi Chemical Asia-Pacific Pte Ltd
Engineering Dept.
Artwork and CAD/CAM section
32 Loyang Way,
Singapore 5455407
Tel: 5428511 x 67 
Fax: 5455407 

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