TECHNET Archives

February 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Job Opportunity
From:
[log in to unmask]
Date:
Mon, 3 Feb 97 9:36:31 CST
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines) 
We are URGENTLY looking for a materials engineer with a few years of 
experience to work on PCB, packaging, reliability assessment, materials 
testing, etc. in the Advanced Technology department.  Please contact me 
ASAP

Kuan-Shaur Lei, Ph.D.
Senior Member of Technical Staff
Advanced Technology Department
Compaq Computer Corporation
P.O. Box 692000, M/S 060105
Houston, Texas 77269

Phone: 	281-518-8099
FAX:  		281-518-8971
E-mail: 		[log in to unmask]


 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2