Following is the program of the Japan-Hong Kong Workshop to be held on
March 5 to 6, 1997.  If you are planning to travel to Hong Kong in this
time frame, please consider adding it to your intinerary. 

Toshiki Sasabe 
__                                                                       __
__  Toshiki Sasabe                           [log in to unmask]  __
__  Digital Equipment Corporation            Phone:  +81-425-32-7650     __
__  Japan PWB Technology Group               Fax:    +81-425-32-7590     __






DVD and High Density Electronic Assembly Technologies Workshop
==============================================================

Hong Kong Productivity Council will co-organize the two-day workshop on
the digital video disk (DVD) and high density elctronic assembly 
technologies jointly with Japan Institute for Interconnecting and 
Packaging Electronic Circuits (JIPC) and Nikkei Electronics Asia.

The main objective is to introduce the participants the latest 
technologies in digital video disk and high density electronics 
assembly, from designing to manufacturing.  DVD products have already 
been marketed since the last November.  The over 4-Gbyte recording 
density will change the consumer electronics and computer peripheral 
market drastically.

High density assembly technologies have enabled conventional desk-top 
equipment such as VCRs and PCs into mobile units including camcorders, 
mobile PCs and mobile telephones.  How should the electronics equipment
be densified for the next target?  Experts in high density assembly 
technologies will clarify it from Japan.

Date: March 5 to 6, 1997
Time: 9:30am to 5:00pm
Venue: Hong Kong Productivity Council in Hong Kong

Program:

1.  DVD Trend in Japan (by Mr Kenji Tsuda, Nikkei Electronics Asia)
2.  DVD Overview and Toshiba Strategies (by Mr Hiroharu Satoh, Toshiba)
3.  DVD Spec and Matsushita Strategies (by Dr Mutsuo Takenaga, 
    Matsushita Electric Industrial)
4.  Electronics Industry in Hong Kong (to be determined)
5.  Build-up PCB for High Density Assembly (by Mr Yutaka Tsukada, IBM 
    Japan)
6.  EMI-Conscious PCB Design (by Dr Norio Matsui, Applied Simulation 
    Technology)
7.  High Density PCB Design (by Tatsuo Hakuta, Sony)
8.  Electronics Industry in Shenzhen (by Mr Ue Lei, Shenzhen 
    Productivity Centre)

Contact:  For details (fee, application, etc) please inquire to:
          Hong Kong Productivity Center (HKPC)
          Mr. Daniel P.M.Chan
          FAX: (852)2788-5770,  Phone: (852)2788-5738 (direct line)
          E-mail: [log in to unmask]

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