I'm looking for a thermal adhesive to use between a component and PWB for
thermal transfer. Properties should be close to the following:
Lap shear 500 psi
thermal conductivity 4.50 BTU... FT2 (.0065 WATTS/CM C)
The material must also meet the fungus and non-nutrient requirements of
MIL-STD-454 Requirement 4. Reworkability is also a requirement... something
like a one part silicon-based adhesive would be nice.
Thanks
Jim Marsico
(516) 595-5879
[log in to unmask]
********************************
* ______ _ _ _____ *
* / ___ | | | | | _____ *
* / /___| | | | | | _____ *
* __/ ____ | | | | |______ *
* |____/ |_| |_| |________| *
* *
* SYSTEMS, INC. *
********************************
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************