Gary: the following prepared by Bill Goers here at the EMPF:

>There are several "prototype" CSP technologies of which I have heard in the
>past 1-2 years.  Tessera does gets some big media hype.
>The one CSP technology I have dealt with comes from your backyard,
>mini-Ball Grid Arrays (mBGA).  mBGA is a Sandia technology (Keith Treece or
>Paul Dressendorfer).
>It was in the "prototype" stages 2 years ago, but have not heard a status
>lately.
>
>I would call them for more info.
******************
>
>>To: [log in to unmask]
>>Subject: DES: ASSY:  Chip Scale package availability
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>>
>>I'm trying to decide when to make the jump to flip-chip in future designs
>but
>>I don't think we're ready for C4 with underfill.
>>
>>Does anyone know of a Chip-scale or Chip-size package other than the
>>Tessera uBGA that is available at present?  How about next year?
>>What part types are available/planned?  Now or future...
>>
>>I saw a lot of ideas at SMI '96 but haven't actually seen any ads for
>>available parts other than the INTEL Flash memory in Tessera's uBGA
>>package.
>>
>>Gary P.
>>---
>>                                  Gary D. Peterson
>>    _/_/_/   _/    _/  _/        SANDIA NATIONAL LABORATORIES     _/_/_/
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