Hi Wesley,
On the prototypes we simply made the castellations non-solderable for the L5
(flip-chip-like) solder connections, in higher quantities we ordered them
from Kyocera without catellation metalisation. If you use high-melt solder
balls, ie. BGA, than you do not have to worry about the castellation stealing
the solder, because the HMSBs woyuld not melt and maintain the solder joint
height. 
You got some reply from Mark Spitnale and he is right, however LCC's
made without a .008  or larger spacing under Mil-STD 2000A required
essentially matched CTEs for components and substrate to assure reliable
solder attachments.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask] 

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