I'm trying to decide when to make the jump to flip-chip in future designs but
I don't think we're ready for C4 with underfill.
Does anyone know of a Chip-scale or Chip-size package other than the
Tessera uBGA that is available at present? How about next year?
What part types are available/planned? Now or future...
I saw a lot of ideas at SMI '96 but haven't actually seen any ads for
available parts other than the INTEL Flash memory in Tessera's uBGA
package.
Gary P.
---
Gary D. Peterson
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