"SLC" is an IBM developed BUM (built up multilayer) process which
utilizes a photo-via technology.   "PhotoLink" is also a BUM technology
using a CIBA curtain-coated liquid photo-via technology produced by
Continental Circuits, Inc. in Florida.  Another BUM technology utilizes
a thin, glass free resin coated copper with vias either laser or plasma
ablated.

Kevin R. Thomas
AlliedSignal Laminate Systems
MicroVia Materials Product Manager
Ph :  608.791.2288
E-mail :  [log in to unmask]




SLC and Photolink are commercially available Built-up Multilayer (BUM)
products , also known as Sequential Build-Up (SBU), boards. SLC and
Photolink are both using photo-via technology.




>>>From: [log in to unmask]
>>>To: [log in to unmask]
>>>Subject: Built-up Up Multilayer
>>>Date: Thursday, February 06, 1997 8:32PM
>>>
>>>
>>>Technet-
>>>What are the differences between "SLC", "Photolink" and "BUM".  Are
>>>there differences in design / material ?
>>>
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