I am looking for sources of information regarding the use of COB and TAB.  I 
am in the investigative phase of an IRAD project.  Any information regarding 
equipment suppliers, full service suppliers, etc would be useful.


As I begin this investigation, I am quickly leaning towards including Chip 
Scale Packaging.  The January 1997 Electronic Packaging and Production had a 
very good article on this.  Since CSP is defined in J-STD-012 as "no larger 
than 1.2x larger than the die" it seems like it may be the best alternative 
(much more conventional processing).


Does anyone know the availability of CSP (now and near future?)


I am looking into who might repackage die into this form on a custom basis. 
 I'll share that information with the group.


Thanks,

Michael Lang
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