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February 1997

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Fri, 7 Feb 97 12:50:40 PST
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--- On Fri, 7 Feb 97 12:11:42 PST  [log in to unmask] wrote:


Dear collegues ,

I am looking for
Designrules for Laouting of PCB's for  BGA (Ballgrid Array)-Assembly
especially Requirements of Solder masks.
Who can help me find some documents  about this matter  (IEC-Standards,  IPC-Standards )?
Is there a working group in preparing these standards ?

I am very interested in answers.

M. Jeremias

Daimler Benz Aerospace
Sensorsystems

Advanced technologies






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