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   TO:         I4235700 IBMMAIL   new address for ipc technet 25.6.96

   FROM:       DSTEWART EX2       D.Stewart        - Product Development Manager.

   DATE:       6 February 1997
   SUBJECT:    High Density Interconnect
   REFERENCE:  definition?

    I have been having discussions with customers about how many
    distribution / high density interconnect layers etc are possible
    with the new microvia technologies, and we suddenly realised that
    some of the time we were talking cross purposes, because nobody has
    really defined what is a high density interconnect/distribution
    layer. If someone quotes 3 layers of HDI, does this mean 2
    dielectric seperations with vias linking, or 3 dielectrics?
    With our laser process linking layer 1-2, I would suggest that this
    gives 2 layers of HDI or distribution, as the high density is
    achieved by reducing via pad sizes down to 10 mil or less.
    Any views or definitions on this?

    Dougal Stewart
    Product DEvelopment manager
    Exacta Circuits
    Scotland

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