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Date: | Tue, 4 Feb 1997 16:38:46 -0600 (CST) |
Content-Type: | TEXT/PLAIN |
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Try J-STD-013, Implementation of Ball Grid Array and other High Density
Technology. It is available through the IPC; $35 for members, $70 for
nonmembers.
Call (847) 509-9700 x 318 to reach our order department.
****************************************
Lisa M. Williams
Technical Staff
IPC
2215 Sanders Road
Northbrook, IL 60062
phone: (847) 509-9700 x 379
fax: (847) 509-9798
email: [log in to unmask]
****************************************
On Tue, 4 Feb 1997, Glynn Shaw wrote:
> Greetings All.
>
> I have a customer who is starting to place BGA's on his pcbs using an
> in-house developed CAD system. He has the BGA footprint specs from the part
> suppliers but lacks the knowledge/experience to optimize the pcb for
> assembly of these devices. He is looking for specs which will help him to
> properly design his boards to accept BGA devices-- and additionally, any
> special requirements which might be necessary for the various types of BGA
> devices (column vs ball).
>
>
> Any suggestions?
>
> Glynn Shaw, President
> Proto Engineering Corp.
> 181 Commercial St.
> Sunnyvale, Ca. 94086
>
> email: [log in to unmask]
> phone: (408)738-0693
> fax: (408)738-1290
> modem: (408)738-1388
>
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