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Mike Middleton asked how other organizations handle documentation of
soldering for inductive components, since these devices are largely
ignored by conventional soldering standards. At Northrop Grumman
ESSD, we have a process specification specifically for inductive
components. It includes provisions for higher-melting solders and
attachments between lead wires and windings of various kinds. As with
all our process specifications, it expresses engineering requirements
only, not manufacturing instructions, per MIL-STD-490, Specification
Practices.
Gordon Davy
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