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February 1997

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Thu, 27 Feb 1997 16:27:21 PST
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From [log in to unmask] Fri Feb 28 08:
56:41 1997
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Subject:
SPC for HAL solder coating process
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[log in to unmask] (Dave Willhard)
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Compeq International; Quality Assurance
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Need information on applying SPC to solder thickness data from 
a hot-air-leveling solder coating process (vertical).  I would be
interested in knowing what data collection and charting methods
you are using.  We have a current system but question its validity
due to wide variety of board designs run through process (each lot
has its own design and, therefore, its own tendency toward certain
solder thicknesses at certain locations).

Thanks.


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