The subject is solder balls on boards reflowed with no-clean paste.
1. Are solder balls allowed and if so what would the maximum size diameter
be? (what specification used?)
2. Could someone please explain the J-standard requirement?
We especially get solder balls (beading) on chip components/discretes.
3. Is anyone using reduced screen apertures to help reduce balls?
If so, what reduction?
James Edwards ([log in to unmask])
Data General Corporation
Apex, NC 27502
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