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Date: | Wed, 19 Feb 1997 16:55:27 -0500 |
Content-Type: | text/plain |
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THE COMMON PRACTICE IN THE IC WORLD OF PLASTIC PACKAGING IS THE USE OF
GOLD WIRE WITH SILVER PLATED FRAMES..
ALUMINUM WIRE IS TYPICALLY USED WITH GOLD, ALUMINUM, AND NICKEL..
A PAPER WAS PUBLISHED YEARS AGO ON BONDING ALUMINUM TO SILVER PLATED
SURFACES.. THE RESULTS SHOWED SEVERE BOND STRENGTH DEGRADATION AND
BOND FAILURE DURING HUMIDITY TESTING. FAILURE MODE SHIFTED FROM WIRE
BREAKS TO BOND LIFTS AS A RESULT OF ALUMINUM CORROSION.
______________________________ Reply Separator _________________________________
Subject: Aluminum wire bond to silver component
Author: [log in to unmask] at smtp
Date: 2/18/97 05:52 PM
A vendor of mine attempted to wire bond using aluminum wire to a
component with silver leads. This seems to have resulted in an
unstable circuit due to poor bond connections. The circuit is a
precision oscillator that is very sensative to phase noise and
frequency shifts. We have seen that bonds have been failing bond
pull at very low levels (.6g to 1.6g) and that multiple attempts
have to be made to get any bonds to stick at all (11 attempts to get
2 bonds, both of which failed at under 2.6g).
Q: What are the risks and problems associated with using aluminum
wire bonds to a silver contact?
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