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Date: | Fri, 14 Feb 1997 09:24:29 EST |
Content-Type: | text/plain |
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A: INTERNET--IBMMAIL
De: Natalie Pare
IBM Microelectronic Division
Bromont OEM Marketing
Objet: RE:Blind vias & fineline
Roger, we currently plate ni/imm.Gold on 2 mils line/2 mils space product
without any bridging. With a good surface prep , adequate rinsing , and
proper nickel bath controls, you should be able to plate without any
bridging. Make sure that your copper lines are well defined without any
residues.
Thanks.
Regards, Natalie Pare,eng.
Account Manager, OEM
NPARE @ vnet.ibm.com
590/23/BRMT (tel:514-534-6322, FAX: 534-6800)
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