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February 1997

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From [log in to unmask] Fri Feb 7 14:
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Subject:
ASSEM:Solder Balls
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The subject is solder balls on boards reflowed with no-clean paste.

 1. Are solder balls allowed and if so what would the maximum size diameter
    be? (what specification used?)

 2. Could someone please explain the J-standard requirement? 

    We especially get solder balls (beading) on chip components/discretes.


 3. Is anyone using reduced screen apertures to help reduce balls?
    If so, what reduction?
James Edwards ([log in to unmask])
Data General Corporation
Apex, NC  27502

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