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From [log in to unmask] Mon Feb 24 08: |
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Mr.Hammond
A 1:1 aspect ratio of blind via is limit.
Vibration through electroless,electro plating process and lower current
density in electro plating are very important.
Regards
Motoyo Wajima
General Purpose Computer Division,Hitachi,Ltd.(JAPAN)
[log in to unmask] ,3,ñ,I_`,«,Ü,µ,½_F
> I've heard that the general rule limiting blind vias is a 1:1 aspect
> ratio. You are at it with the 16 mil holes & 16 mil depth. It seems
> like you are doing the right things (i.e. vibration, etc.) so I'm not
> sure what else to suggest.
>
>
> MB
>_____________________________ Reply Separator
_________________________________
>Subject: Blind vias & fine lines
>Author: [log in to unmask] at SMTPLINK-HADCO
>Date: 2/12/97 10:07 PM
>
>
>Techneters,
> Can anyone help? I am having two problem areas:
>
> 1) Blind via holes 16 mil diameter 16 mil deep contacting with 4
>inner layers. I cannot always plate copper into all holes. If I do copper
>plate them I cannot tin plate all the holes. I have vibrators on the
>cathode movement frame and a giant to clout the fight bars with a 2 pound
>hammer. Is there anything else I can do?!?
>
> 2) Circuits with 2 mil track and gaps. The finish required is
>electroless nickel/immersion gold. How can this be done without causing
>the tracks to short with nickel spikes?
>
> Thanks in advance,
> Roger Hammond
>
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