Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vx3mx-0001PJC; Tue, 18 Feb 97 22:37 CST |
Content-Type: |
text/plain; charset=iso-2022-jp |
Old-Return-Path: |
|
Date: |
Wed, 19 Feb 1997 13:47:10 +0900 |
Precedence: |
list |
Resent-From: |
|
Cc: |
|
MIME-Version: |
1.0 |
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
X-Status: |
|
X-Loop: |
|
X-Mailer: |
AL-Mail 1.22 |
Resent-Message-ID: |
<"TEm3_2.0.wd8.UEe2p"@ipc> |
Subject: |
|
From: |
|
Resent-Sender: |
|
In-Reply-To: |
|
From [log in to unmask] Wed Feb 19 12: |
12:28 1997 |
Message-Id: |
|
Parts/Attachments: |
|
|
Motoyo Wajima <[log in to unmask]> さんは書きました:
>Mr.Hammond
>
> A 1:1 aspect ratio of blind via is limit.
> Vibration through electroless,electro plating process and lower current
> density in electro plating are very important.
> Regards
>Motoyo Wajima
>General Purpose Computer Division,Hitachi,Ltd.(JAPAN)
>
>
>[log in to unmask] さんは書きました:
>> I've heard that the general rule limiting blind vias is a 1:1 aspect
>> ratio. You are at it with the 16 mil holes & 16 mil depth. It seems
>> like you are doing the right things (i.e. vibration, etc.) so I'm not
>> sure what else to suggest.
>>
>>
>> MB
>>_____________________________ Reply Separator
>_________________________________
>>Subject: Blind vias & fine lines
>>Author: [log in to unmask] at SMTPLINK-HADCO
>>Date: 2/12/97 10:07 PM
>>
>>
>>Techneters,
>> Can anyone help? I am having two problem areas:
>>
>> 1) Blind via holes 16 mil diameter 16 mil deep contacting with 4
>>inner layers. I cannot always plate copper into all holes. If I do copper
>>plate them I cannot tin plate all the holes. I have vibrators on the
>>cathode movement frame and a giant to clout the fight bars with a 2 pound
>>hammer. Is there anything else I can do?!?
>>
>> 2) Circuits with 2 mil track and gaps. The finish required is
>>electroless nickel/immersion gold. How can this be done without causing
>>the tracks to short with nickel spikes?
>>
>> Thanks in advance,
>> Roger Hammond
>>
>>***************************************************************************
>>* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
>>***************************************************************************
>>* To unsubscribe from this list at any time, send a message to: *
>>* [log in to unmask] with <subject: unsubscribe> and no text. *
>>***************************************************************************
>>* If you are having a problem with the IPC TechNet forum please contact *
>>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
>>***************************************************************************
>>
>>
>>***************************************************************************
>>* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
>>***************************************************************************
>>* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
>>* with <subject: subscribe/unsubscribe> and no text in the body. *
>>***************************************************************************
>>* If you are having a problem with the IPC TechNet forum please contact *
>>* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
>>***************************************************************************
>>
>>
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|