An inefficient gold bath could be an explaination for soldermask peel.
I have seen the damage done by inefficient gold systems on dry film.
It would be a decent test to try to see if the problem goes away. I
would test all other options and ideas before fooling with my gold
system. But if nothing else works......
Remember be careful, every action you take with the gold bath could
lead to other ill effects if you are not prepared.
1) If you want to add more gold (A 100 gallon system would take $20,000 worth
of gold to raise the metal content 0.5 oz/gal) to the system (If management will
even consider sinking more "static" money into the process) be aware that it
will increase your efficiency. Thus you will plate faster and plating times
must be adjusted lower. Also bad distributions will usually be exaserbated.
2) There are other things to try like decreasing ASF and extending plating
times. This will also make the efficiency rise. Once again be aware of the
system shift.
3) Check circulation, if you don't have decent movement you will experience
localized areas of metal depletion which can cause bubbling and resist lifting.
Check with you vendor to see how else to increase bath efficiency and have them
close by to agree with every move you make.
______________________________ Reply Separator _________________________________
Subject: Re: Solder Mask Peel Off
Author: [log in to unmask] at corp
Date: 1/7/97 8:09 AM
TO HAWK CHEN
Hawk, I've seen this problem before and found that the gold
bath had a lower gold content which caused more hydrogen
gassing and made the plating more inefficient. This
loosened the soldermask at the gold tab interface. The
addition of gold improved the situation.
Another thing which greatly improved all soldermask peel was
changing from a chemical preclean to a pumice scrub
preclean. This was especially true when trying to avoid
soldermask peel in electroless nickel/immersion gold
processing.
Dave Sullivan
Rockwell Collins, Inc.
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Solder Mask Peel Off
Author: [log in to unmask] at ccmgw1
Date: 1/3/97 9:35 PM
Friends:
We encounter a problem with solder mask peel off which is near gold
finger, while after gold plated.
Is there anybody experience to this problem solution ?
Our solder mask in use is "Tamura" & "Taiyo". Gold plating tank is deep
type.
Thanks and Best Regards,
Gloria Electronics, Taiwan
R & D Chief
Hawk Chen
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