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January 1997

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Subject:
From:
Seth Tompkins <[log in to unmask]>
Date:
Mon, 06 Jan 1997 10:15:15 -0800
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Hello Technet!

I used this forum once before and you all were very helpful.  So, I
thought I'd ask another question that I thought you all may be able to
help me with.

I do market research for a company that is expanding into the electronic
adhesives area.  I was trying to find some sort of concensus on what is
the preferred method for adhering electronic components to circuit
boards:  solder paste or surface mount epoxy?

I was trying to see if there were any trends moving either toward or
away from epoxies.  Any insight that you can offer would be greatly
appreciated.  Just a few words would be excellent.

Thank you all in advance for your help,
Seth Tompkins
Detroit, Michigan

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