TECHNET Archives

January 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Mixed Tech Assy
From:
Jim Zanolli <[log in to unmask]>
Date:
Thu, 30 Jan 1997 12:34:35 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines) 
Teka Interconnection Systems (a connector mfg) is in the final development
stage of a product that could eliminate secondary soldering processes such
as wave soldering for certain mixed tech board assy's and allow for inline
reflow without additional solder paste or flux.

We are looking for interested parties with forced convection ovens with whom
we could do beta testing. Interested parties please respond to:

Jim Zanolli
Teka Interconnection Systems
phone: 401-785-4110
fax: 401-781-5730
Best Regards
Jim Zanolli

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2