We have some paper phenolic PCA's in our future and I was wondering if
there are any drastic differences to processing vs. FR-4 assemblies. 
Some of the questions I have are the following.

1.) Do mixed paper phenolic assemblies have a higher defect rate than
FR-4 mixed technology assemblies?

2.) What are the defects commonly seen on the paper phenolic assemblies
which you do not get with FR-4 PCBs' and PCAs'?

3.) What is the largest panel size you can run with .062" material?

4.) Does every paper phenolic panel require wave soldering pallets?

5.) Is there any problems with water washing of paper phenolic boards?

6.) Is there any stretch or warp of the PCB through the thermal
processes?

7.) Is there any special fixturing required for reflow soldering?  

8.) Are the PCB's processed as single images or panelized as they pass
through the SMT and/or TH processes?

9.) Is there any special handling processes or cleaning processes prior
to assembly?  Any special process during or after assembly?

10.) With respect to the copper adhesion to the PCB, is rework more
difficult (than FR4) due to the ease of pulling pads off the board?

11.)  Does the PCB material effect the price that the CM charges for
building the assembly?  If so, why? 

12.) What are the changes to the reflow profile?  Is the soak time
longer or shorter?  Is the max temp setpoint different than FR4?

Thanks In Advance:

Steve O'Hara
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