I'm posting this on Technet only in reference to past messages looking
for Analytical labs. I didn't know at the time that our labs did
external work but they do.
Gerry
=======================================================================
=========
----------
From: Paul Terranova, MCG MRO Engineering Lab,
297-3109[SMTP:[log in to unmask]]
Sent: Wednesday, January 29, 1997 3:46 PM
To: Gagnon, Gerry; Gagnon, Gerry
Cc: [log in to unmask]
Subject: DIGITAL Analytical and Env. Test Services Lab capabilities
+---------------------------+ TM
| | | | | | | |
| d | i | g | i | t | a | l |
| | | | | | | |
+---------------------------+
To: Gerry Gagnon
SUBJECT: Failure Analysis Lab at DIGITAL
Enclosed is a list of some of our laboratory's capabilities. This
list is not
all inclusive, but meant to give a representative picture of our
services. Our
rates are very competitive and we don't charge extra for
photodocumentation
(Poloroids).
Our specialty areas include: evaluation of PWBs, SEM, metallography,
connector
evaluations, IC packaging analysis, and IC failure analysis. We also
have
extensive Environmental capabilites such as liquid to liquid thermal
shock,
HAST, thermal cycling, and temp/humidity testing. If you have any
questions,
please contact me via phone or email.
Best regards,
Paul Terranova
508-467-3109
[log in to unmask]
m
=======================================================================
=====
** Materials/Metallurgical Analysis **
- Cross sectioning (Metallography)
- Plating thickness determinations
a) non-destructive by x-ray fluorescence (XRF)
b) from cross sections using calibrated filar eyepieces
- Visual and mechanical inspection (VMI)
- PWB/Module evaluations and qualifications
- PWB impedance testing (Time Domain Reflectometry)
- Microhardness testing (Knoop and Vickers)
- Dimensional feature measurements
- Scanning electron microscopy (SEM) and elemental analysis (EDX)
- Electrical, mechanical, and metallurgical failure analysis
- Surface Profilometry
- Solderability assessment
- Solder joint integrity analysis
- Contamination and corrosion identification
- Photo-documentation (low and high magnification)
- X-ray radiography
** Electrical Testing **
-Electrical characterization
-Discrete component analysis
-Electrical testing/diagnosis of failed products
-Power products test (power supplies)
-Components applications analysis
-ESD protection analysis of materials, products, and processes
** IC Failure Analysis **
-Focused Ion Beam (FIB) cross sectioning, and device modification
-I.C. die cross sectioning and construction analysis
-Field Emission Scanning Electron Microscopy (FESEM)
-I.C. Failure Analysis
-Voltage contrast/E-Beam probing analysis and design debug
-Long working distance, high magnification optical microscopy
-Liquid Crystal Analysis
-Precise microprobing
-IC ESD testing and evaluation with Human Body Model, Machine Model
and
Charged Device Model waveforms
-Latch-up testing
-IC/semiconductor cross-sectioning
-Wet chemical and plasma etching abilities
** Environmental Test Services **
- Liquid thermal shock
- Temperature cycling and temperature/humidity testing
- Burn-in ovens
- HAST
- Autoclave (pressure cooker testing)
- Thermal impedance testing
- Gross and fine leak testing
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