Here is some more info (provided by Stan Whelan of Northrop Grumman
ESSD) on the above subject:
The most comprehensive bibliography is "Plastic Microcircuit Packages:
A Technology Review", Priori, M.G. and Farrel, J.P., available from
the Reliability Analysis Center, PO Box 4700, Rome NY 13440-8200,
ordering No. No. CRTA-PEM,OR DTIC, Cameron Station, Alexandria, VA
22314-6145, Report No.F30602-91-0002.
A second bibliography that is more recent was being developed by the
Commercial Parts Utilization Committee of the DARPA initiated Afford-
able Multi-Missile Manufacturing task. The committee chairman is/was
Doug Hastings, Loral Aeronutronic (now Lockheed Martin), 29947 Avenida
De Las Banderas, PO Box 7004,Rancho Santa Margarita, CA 92688-7004.
My thanks to Stan for providing this info.
Gordon Davy
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