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January 1997

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Subject:
From:
"Edwards, Ted A (AZ75)" <[log in to unmask]>
Date:
28 Jan 1997 17:18:38 -0600
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First off, regarding any reaction that generates or used chlorine gas it 
requires a thorough understanding of the operation and chemistry of the 
system.   Only personnel with proper equipment and that definitely includes 
very good ventilation with a fume scrubber on the ventilation system, and 
more importantly a good understanding should attempt to do this as the 
reaction basically involves the addition to the solution of chlorine gas or 
creation of chlorine gas in the solution and you do not want this nasty 
chemical in your breathing area  Chlorine gas really can kill you, and if it 
does not get you when you breath it can cause chemical pneumonia. A good 
chlorine detection and alarm system should also be installed.
I would suggest you talk to your etcher machine supplier, or if you are just 
contemplating this talk to Marshal Gurian at ASI 602-276-7361 (who makes 
etching systems)as they have a lot of experience.
Over the years there have been a number of units to add the HCl and  sodium 
chlorate starting with Vis-U-Etch or the Chemcut colormetric solution color 
monitoring system.  ORP overcomes a problem that all the colormetric systems 
had at one time or another of salts plugging the line to the colormetric 
cell but even with it some maintenance is required as the chemistry is 
corrosive, it does not know which copper you want to keep (the system 
wiring) and that which you want to remove ( the excess copper on the board). 
 I have used both chlorine gas and chlorate/HCL and for ease of operation 
the chlorate is IMO easier to operate.  Opening the chlorine gas cylinders 
requires a vacuum which means you need an injector large enough to generate 
a good vacuum.
 Here are some literature references you might want to look at.
     Steady State Etching of Copper-Cupric Chloride, Sodium Chloride Baths, 
L.Missel and F.D.Murphy, Metal Finishing, December 1969 p47-52,58.
     Steady State Regenerative Etching: A Technology Review, Marshal Gurian, 
ASI, Electronic Packaging and Production July 1978, p32-36.
     Etchant Fountain of Youth? Circuits Manufacturing, November 1976, p 
72-73.
I also think I heard that chlorine gas cylinders must now be in a enclosure 
that completely contains and neutralizes all gas if their is any accidental 
releases and you may want to ask about whether this is a requirement.

     [log in to unmask]

The opinions expressed here are those of Ted Edwards and may or may not 
reflect the opinion of my employer.
 ----------
From: Ted Stern
To: [log in to unmask]
Subject: FAB:  Cupric chloride regeneration with sodium chlorate
Date: Wednesday, January 22, 1997 1:07PM

I was wondering if any of you fabricators out there would provide me
with information on the following:

a.  method of regerating CuCl2 final etch with sodium chlorate,
including sodium chlorate concentration, HCl additions, rate of
additions, equipment used;

b.  method of automated control (ie. ORP control versus colormetric
control); and

c.  opinions on the ease of use (or lack thereof) of sodium chlorate
versus chlorine gas;

Thanks for you help!

Ted Stern
612-479-6525
[log in to unmask]

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