Thanks for my good friends's suggestions:

Our gold plating line is electrolytic,tap, deep tank(plating two rows of
G/F
in one throughput),tape definition,gold content 3.5 g/l.
Our problem have no gold or nickel peeled off, only on the top of G/F
with
solder mask peeled off after gold plated, while stripping the tape we
found.

Thanks for more information & suggestions.   

Hawk Chen wrote:
> 
> Friends:
> 
>   We encounter a problem with solder mask peel off which is near gold
> finger, while after gold plated.
>   Is there anybody experience to this problem solution ?
> Our solder mask in use is "Tamura" & "Taiyo". Gold plating tank is deep
> type.
> 
> Thanks and Best Regards,
> 
> Gloria Electronics, Taiwan
> R & D Chief
> Hawk Chen

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