Marshall:
     
     Not to hedge, but it depends.  If you are in Arizona in the summer you 
     could probably leave it out for a week, but in Florida in the summer 1 
     hour could be to long.  It really depends on the ambient conditions.  
     To be on the safe side the rigid-flex should be baked 1 hr @ 250 F 
     prior to solder operation.  If you need to leave out for a period of 
     time after bake, leave parts under a heat lamp.
     
     Regards,
     
     Ron Yanuszewski


______________________________ Reply Separator _________________________________
Subject: Assy: Rigid Flex
Author:  [log in to unmask] at !INTERNET
Date:    1/24/97 2:00 AM


What is the maximum period of time that a rigid-flex board consisting of 
glass reinforced polyimide board and polyimide flex, can be left out of the 
dry box on the assembly floor before it should be re-baked to insure that it 
will not blister or de-laminate?
     
Thanks in advance for helping clear up a discussion between a board supplier 
and an assembler.
     
Marshall Andrews
[log in to unmask]
     
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