TECHNET Archives

January 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Fri, 24 Jan 1997 00:01:34 -0500 (EST)
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines)
That was a great reply Dave.  Let's hope it stimulates the techs to find a
better way to copper plate.  Or plate any metal for that matter.  There's no
question that superior technology is waiting to be discovered and utilized,
not only equipment technology but chemical process technology as well.


***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2