For testing you should use IPC-SM-785, 'Guidelines for Accelerated
Reliability Testing of Surface Mount Solder Attachments'. But it is quite
likely that a reliability analysis as per IPC-D-279, 'Design Guidelines for
Reliable Surface Mount Technology Printed Board Assemblies' or ANSI/IPC
J-STD-013, 'Implementation of Ball Grid Array and Other High Density
Technology' will give you a good enough indication of reliability to avoid
accelerated testing, which frequently is done improperly because of time and
resource constraints, all together. 

I will give a workshop "Practical Design and Prediction Methods for Surface
Mount Solder Joint Reliability" at NEPCON West dealing with 'Design for
Reliability' and testing issues. 

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask] 

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