TECHNET Archives

January 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Assy: Rigid Flex
From:
Marshall Andrews <[log in to unmask]>
Date:
Thu, 23 Jan 1997 14:18:12 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
What is the maximum period of time that a rigid-flex board consisting of
glass reinforced polyimide board and polyimide flex, can be left out of the
dry box on the assembly floor before it should be re-baked to insure that it
will not blister or de-laminate?

Thanks in advance for helping clear up a discussion between a board supplier
and an assembler.

Marshall Andrews
[log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2