Text item: 

     Sanjay,
     
     I can only help in your first inquiry.
     
     I had an excellent reference on QFP a while back.  This was a 
     packaging databook for Cirrus Logic parts (100 pin, 208 pin, etc.) 
     and was JEDEC and others compliant -I don't think IPC gets into 
     package coplanarities!!  You can start from there.
     
     If you don't get quicker responses from technet, call Cirrus up.  
     The area code there is 510.  They are in Fremont (pronounced 
     Freemont, I could never figure why!)
     
     Hope this helps.
     bilal


______________________________ Reply Separator _________________________________
Subject: GEN: Lead Coplanarity Spec??
Author:  [log in to unmask] at SMTPGATE
Date:    1/22/97 10:53 AM


Technetters:

I have a couple of questions and would appreciate
any input...

1. What is the JEDEC/IPC spec on lead coplanarity
    for QFP's?

2. Can anyone recommend any tinning houses that would
    tin surface mount packages for us?  I know one such place
    is Corfin, are there any other popular ones?


Thank you

________________________________________________
Sanjay Rajan        RF Communications Division
Harris Corporation  Product Design Engineering
1680 University Avenue   Phone:    (716) 242-3923
Rochester, NY 14610 Fax: (716) 242-3174
________________________________________________

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