Technetters:

I have a couple of questions and would appreciate
any input...

1. What is the JEDEC/IPC spec on lead coplanarity
    for QFP's?

2. Can anyone recommend any tinning houses that would
    tin surface mount packages for us?  I know one such place
    is Corfin, are there any other popular ones?


Thank you

________________________________________________
Sanjay Rajan        RF Communications Division
Harris Corporation  Product Design Engineering
1680 University Avenue   Phone:    (716) 242-3923
Rochester, NY 14610 Fax: (716) 242-3174
________________________________________________

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