Spraying the board will not assure that the under side of the
     SMD and the board under it are coated.
     
     This can only be accomplished by dipping.
     
     In the worst case, you may have to pull a soft vacuum on the 
     board, while submerged in solution, to get coating under the 
     device. Now that you have pulled the coating under the device
     the space likely will retain the coating. Then you have to worry
     about thermal expansion of the cured coating popping the device off
     the board.
     
     Educate your customer. A 100% moisture seal means glass, 
     ceramic or metallic coatings. You cannot achieve this 
     with a polymer.
     
     The opinions stated herein are not necessarily those of my employer.

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