Following from the EMPF HelpLine in Indianapolis, prepared by Jim Moffitt,
member IPC-A-610 Technical Committee:
The requirement in A-610 is descended from a
>similar requirement in J-STD-001 (which in turn is descended from a
>requirement in Mil-Std-2000). The requirement is intended to apply only to
>leaded devices, initially axial-leaded devices. The need is to provide
>enough cushioning to an axial leaded device which is mounted to pth's so
>that the differential in Tce between the epoxy used to secure the component
>and the component/pwb combination do not fracture the glass seals of the
>component (thereby compromising the component hermeticity). In any event,
>the requirement is not intended to be applied to MELF or other leadless
>components. Regards, Jim Moffitt/EMPF
>
>
>
>At 10:44 AM 1/16/97 -0500, you wrote:
>>>Resent-Date: Thu, 16 Jan 1997 09:06:16 -0800
>>>Resent-Sender: [log in to unmask]
>>>Old-Return-Path: <bellivea@sippican>
>>>From: [log in to unmask]
>>>To: [log in to unmask]
>>>Date: Thu, 16 Jan 1997 09:15:22 +0000
>>>Subject: melf's
>>>X-Confirm-Reading-To: [log in to unmask]
>>>Priority: normal
>>>Organization: Sippican, Inc., Marion, MA
>>>Resent-From: [log in to unmask]
>>>X-Mailing-List: <[log in to unmask]> archive/latest/9295
>>>X-Loop: [log in to unmask]
>>>Precedence: list
>>>Resent-Sender: [log in to unmask]
>>>
>>>Technetters
>>>
>>>I have a customer who asks?
>>>
>>> How can you apply adhesive to MELF's that will be wave soldered,
>>>when section 2.4.2 of IPC-610 states that "Adhesive contacts an
>>>unsleeved glass body component." is a nonconforming defect.
>>>
>>> I say that there is a difference.
>>>Adhesives used to bond a component in section 2 is for mechanical
>>>holddown and the component could crack if it were applied to the
>>>glass body.
>>>
>>>Adhesive used for staking in section 10 has very little strength and
>>>used only to hold the part until it is soldered.
>>>
>>> anyway thats my story and I'm sticking to it.
>>>
>>>
>>>Phil Belliveau
>>>Sippican, inc.
>>>7 Barnabas Rd
>>>Marion, MA 02738
>>>TEL: 508-748-1160 x379
>>>FAX: 508-748-3086
>>>EMAIL: [log in to unmask]
>>>HOME PAGE : HTTP//WWW.SIPPICAN.COM
>>>
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>>
>>***ALL NEW EMPF PHONE NUMBERS***
>>
>>Jack Crawford, HelpLine Coordinator
>>Electronics Mfg. Productivity Facility
>>****NEW--317.655.3688
>>****FAX 317-655-3699
>>714 N Senate Ave, Suite 100
>>Indianapolis IN 46202-3112
>>VISIT OUR HOME PAGE AT: http://www.empf.org
>>[log in to unmask]
>>
>>
>>
>>
***ALL NEW EMPF PHONE NUMBERS***
Jack Crawford, HelpLine Coordinator
Electronics Mfg. Productivity Facility
****NEW--317.655.3688
****FAX 317-655-3699
714 N Senate Ave, Suite 100
Indianapolis IN 46202-3112
VISIT OUR HOME PAGE AT: http://www.empf.org
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