TECHNET Archives

January 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Bill Gaines B160 x2199 <[log in to unmask]>
Date:
Mon, 20 Jan 97 16:54:39 PST
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)

The Orange Chapter of IMAPS (a merging of IEPS and ISHM) January meeting
is on 3D Stacked Silicon Packaging, by David Shostak of Irvine Sensors.
23 January 97 at the Wyndham Garden Hotel, Costa Mesa, $16.00 

Please RSVP to Misri Lai, 714-447-2561

Upcoming event:  During Nepcon West > Jount Tecnical Societies Meeting,
					Mars Pathfinder, 26 Feb, Anaheim, Calif

for e-mail questions: Bill Gaines  [log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2