Hi Vijay,
 J-STD-001 and  IPC-610 do not address the reliability issues of solder
attachments; they do address the issues of the quality of the solder
attachments. However, while quality is necessary to assure reliability, it is
not adequate. The severity of the loading conditions during use will vary
depending on the application, and an assembly perfectly reliable for a benign
application could fail miserably in a more severe one. For reliable
assemblies, you need to follow IPC-D-279, 'Design Guidelines for Reliable
Surface Mount Technology Printed Board Assemblies', in which 'Design for
Reliability' and the issues that lead to premature failures are addressed.
Note that D-279 is a guidelines document not a specification. There can not
be a generally applicable specification on reliability other than specifying
the performance and reliability requirements, certainly none that could
"serve as a self-contained reference for BLIND implementation so that the
INDUSTRY".

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]

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