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Subject:	RE: qualification plan for BGA soldering process.
From:	"Max Bernhardt "<[log in to unmask]>
Date:	Fri, 3 Jan 1997 07:57:00 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (51 lines)

Any data that you obtain would be of great interest to us.  We also
operate in a similar environment and have not used BGA's because we
didn't think that they would stay on due to the thermal mismatch between
the board and the chip.
 ----------
From: OBRIEN GERARD
To: [log in to unmask]
Subject: qualification plan for BGA soldering process.
Date: Thursday, January 02, 1997 4:04PM

we would like to change over from QFP's to BGA in our assembly process
but before doing so I need to define  the reliability test program for
the assembly process. The environment that the assembly will be used in
undergoes many thermal excursions during a day, -40C to + 30C is not
untypical.
Any suggestions regarding a specification that I can use as a starting
point. The BGA's will be plastic body up to 400 I/O's.

Regards.

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