TECHNET Archives

January 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Fab: Finish LPI thickness on circuits
From:
sam mccorkel <[log in to unmask]>
Date:
Fri, 17 Jan 1997 15:25:01 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines) 
We're having difficulties trying to get .001" of LPI solder mask thickness
on 2 oz. bare copper circuits.
We're screening with a DP-10 using 60 and/or 70 durometer squeegee material.
Our screen mesh count has been 86 - 110. We flood - print - print. Any
suggestions would be greatly appreciated. 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2