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January 1997

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From:
"ddhillma" <[log in to unmask]>
Date:
Fri, 17 Jan 97 07:38:03 cst
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     Hi Rob!
     
     Just to add a quick note to the other response's on immersion tin and 
     tin whiskers - electrolytic tin is not the only tin finish type that 
     can exhibit whiskers. Take a look at Solder in Electronics by Klein 
     Wassink, ISBN 0-901150-14-2, pages 197-202 for other causes of tin 
     whisker formation. Many folks have solved the tin whisker problem by 
     using a small percentage of another element (i.e. lead) to "poison" 
     the tin and prevent the formation of the whiskers. The bigger issue is 
     the poor solderability of the tin finish itself. Two other sources of 
     info which may be helpful are:
     
     "Influence of Temperature, and Humidity on the Wettability of 
     Immersion Tin Coated Printed Wiring Boards", by Urmi Ray, Iris Artaki, 
     Paul Vianco, IEEE Transactions on Components, Packagaing,and 
     Manufacturing Technology, Part A, Vol. 18, No.1, March 1995.
     
     AMP's web page - Whiskerless tin: 
     http://www.amp.com/product/articles/dd50.html
     
     Have fun!
     
     Dave Hillman
     Rockwell Collins
     [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: immersion tin 
Author:  [log in to unmask] at ccmgw1
Date:    1/16/97 11:13 PM


Hello to all,
     
I thought " tin whiskers" only occurred with electrolytic 
plated tin.   Is it not the stresses induced during plating that 
provide the energy to produce the whiskers?  In any case I
have used immersion tins on pcbs  for many years, both
as a short term finish in captive shops and as a rework  for 
outdated HASL boards.  The new 1 part liquids make the 
process much easier.  You need only  about 20 mins at 
100 F to put down about 20 millionths.  thats millionths with 
six zeroes, certainly not enough to sustain whisker growth.
     
As with all plating processes the base metal must be 
"meticuously"? well very clean.  Copper  will require a 
microetch , tin/lead may require a solder brightener step 
if highly oxidized.   If the copper is not clean immersion 
tin will not take thus making inspection easy.  As always
the solderability time limit will depend storage conditions. 
I've seen them last for 6-8 weeks on the floor during a brutal 
South Carolina summer.  
     
     Remember, all the tin is doing is protecting that perfectly
clean  copper surface from the elements with something that 
will help your solderpot ratios. Contact your supplier for the
processing details.  But try it you'll like it.  And if the project 
gets hung up for some reason don't fret, just wrap them up like 
Cristmas leftovers and keepem in the fridge.  
Robert E. Welch
Process Specialist
Email: [log in to unmask]
Modem: 804-239-9120
Fax:   804-237-3048
     
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