Hi Phil -
     
     Let me ask this question: When you do put adhesive on a MELF for wave 
     soldering purposes, do you have an failures? I would put forth that if 
     you have sufficient documentation showing that your procedure results 
     in no reduction of reliability for the use environment the assembly is 
     going in then ignore the "specification". Specifications are not 
     (well, should not be anyway) set in concrete - JSTD 001 is an example 
     of a specification that allows for processes to be fit to their use 
     environments. I wouldn't get wrapped up in the specifications words if 
     you can show proof that a process/assembly method is reliable. 
     Hopefully your customer will look at the situation the same way. Good 
     luck.
     
     
     Dave Hillman
     Rockwell Collins
     [log in to unmask]
     


______________________________ Reply Separator _________________________________
Subject: melf's
Author:  [log in to unmask] at ccmgw1
Date:    1/16/97 9:23 AM


Technetters
     
I have a customer who asks?
     
     How can you apply adhesive to MELF's that will be wave soldered, 
when section 2.4.2 of IPC-610 states that "Adhesive contacts an 
unsleeved glass body component." is a nonconforming defect.
     
     I say that there is a difference.
Adhesives used to bond a component in section 2 is for mechanical 
holddown and the component could crack if it were applied to the 
glass body.
     
Adhesive used for staking in section 10 has very little strength and 
used only to hold the part until it is soldered.
     
     anyway thats my story and I'm sticking to it.
     
     
Phil Belliveau
Sippican, inc.
7 Barnabas Rd
Marion, MA 02738
TEL: 508-748-1160 x379
FAX: 508-748-3086
EMAIL: [log in to unmask]
HOME PAGE : HTTP//WWW.SIPPICAN.COM
     
*************************************************************************** 
* TechNet mail list is provided as a service by IPC using SmartList v3.05 * 
*************************************************************************** 
* To unsubscribe from this list at any time, send a message to:           * 
* [log in to unmask] with <subject: unsubscribe> and no text.        * 
*************************************************************************** 
* If you are having a problem with the IPC TechNet forum please contact   * 
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      * 
***************************************************************************
     

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************