Technetters

I have a customer who asks?

     How can you apply adhesive to MELF's that will be wave soldered, 
when section 2.4.2 of IPC-610 states that "Adhesive contacts an 
unsleeved glass body component." is a nonconforming defect.

     I say that there is a difference.
Adhesives used to bond a component in section 2 is for mechanical 
holddown and the component could crack if it were applied to the 
glass body.

Adhesive used for staking in section 10 has very little strength and 
used only to hold the part until it is soldered.

     anyway thats my story and I'm sticking to it.
 

Phil Belliveau
Sippican, inc.
7 Barnabas Rd
Marion, MA 02738
TEL: 508-748-1160 x379
FAX: 508-748-3086
EMAIL: [log in to unmask]
HOME PAGE : HTTP//WWW.SIPPICAN.COM

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