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Date: | Thu, 2 Jan 1997 23:16:54 -0500 |
Content-Type: | TEXT/PLAIN |
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I am curious, about the manufacturing of rigid/flex circuits.
At our shop, we currently are not looking into any type of technology
similar to this. I would like to know the considerations of working
with a process such as this.
I have heard that the lamination technique is somewhat different than
conventional rigid multilayer processing. Also, another difference I
have heard is the registrationing of the flex to rigid.
I would appreciate if someone could give me some insight on rigid/flex
processing.
Thanks in advance
T. Gaylor
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