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January 1997

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Tue, 14 Jan 1997 23:00:10 -0500 (EST)
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Michael Cussen, [log in to unmask], 1-810-477-3900-3306 writes: 
  'I would like to know if anyone has any reliability information on the TSOP
and
   PLCC at 120 degrees F., to 150 degrees F, during the life of the assembled
   board.' 

Yes, there is reliability info on TSOPs and PLCCs. You could start with
IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed
Board Assemblies', or take my workshop "Practical Design and Prediction
Methods for Surface Mount Solder Joint Reliability" at NEPCON West.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]

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