To add an additional thought to this process, I have used a higher solder
alloy (90Sn/10Pb) in order for this solder joint not to become molten and
lift of the board.  I have also used one second U/V cure adhesive to retain onto the board the thermocouple wire.

Good luck

Ed Wong
Wongtronics Lab. Inc.
[log in to unmask]
  
On Fri, 10 Jan 1997 14:17:42 -0500 (EST) Allen Hertz
<[log in to unmask]> writes:
>Bill has a great point! I would like to expand on it a bit........
>
>The optimal process utilizes material properties to calibrate the 
>profiling 
>system. If you use the solder alloy which you are reflowing to secure 
>the T/C to 
>a particular pad, there will be a flat spot (transition temperature) 
>in your 
>profile. Then secure the T/C down in another area with epoxy. Chip 
>bonder works 
>great. This may alter your actual temperature ever so slightly. 
>
>PS - it did clear as well as confuse ISO auditors who could not 
>understand 
>properties of materials!
>
>Enjoy the tip,
>Allen
>
>_______________________________________________________________________________
>
>Subject: Re: ASSY: thermocouple adhesive
>
>From:    [log in to unmask] at ftl03
>
>Date:    1/10/97  1:04 PM
>
>
>
>Why not use solder its better !
>
>Bob Willis
>Process Engineering Consultant
>Electronic Presentation Services
>2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
>Tel: (44) 01245 351502
>Fax: (44) 01245 496123
>Home Page: http://ourworld.compuserve.com/homepages/Bwillis
>Email: [log in to unmask]
>
>
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