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January 1997

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Subject:
backfilling holes at press
From:
"Marc Strickland" <[log in to unmask]>
Date:
Sat, 11 Jan 1997 03:23:24 -0500
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We are evaluating the process of backfilling holes at press. The typical
problems with this process include: 1) Some of the hole do not get filled.
2) The holes appear to have divots (partially filled holes).
3) An excessive amount of resin is left on the surface of the board.
We have tried many different ways of performing this task. Each way appears
to have its own problems.

What is the best process currently being used in the industry!

"We Are Star Stuff"
Marc Strickland
[log in to unmask]
"Byte Me"

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